composition of fixing resin, rotor, automobile and rotor manufacturing method

专利摘要:
FIXING RESIN COMPOSITION, ROTOR, AUTOMOBILE AND ROTOR MANUFACTURING METHOD The present invention relates to a solid fixing resin composition, which has excellent filling properties, and a rotor that uses it. The fixing resin composition is used to form a fixture (130) which constitutes a rotor that includes a rotor core (110) which has a laminate formed by laminating a plurality of plate elements, is fixed and installed in a rotation axis (170), and has a plurality of hole portions (150) arranged along the peripheral portion of the rotation axis (170), provided in the laminate; a magnet (120) inserted in the hole portion (150, 152, 154a, 154b, 156); and a fixing element (130) formed when curing a fixing resin composition, filled in the separation portion between the hole portion (150, 152, 154a, 154b, 156) and the magnet (120), the composition being resin includes a thermoset resin (A) which contains an epoxy resin; a curing agent (B); and an inorganic filler (C), where the ICI viscosity at 150 ° C of the epoxy resin is equal to or less than 3 poises.
公开号:BR112014012761B1
申请号:R112014012761-1
申请日:2012-10-02
公开日:2021-01-12
发明作者:Tetsuya Kitada
申请人:Sumitomo Bakelite Co., Ltd.；
IPC主号:

专利说明:

[0001] [0001] The present invention relates to a fixing resin composition used in a rotor, a rotor, an automobile, and a method for producing a rotor.
[0002] [0002] The priority is claimed in Japanese patent application number 2011-260440, filed on November 29, 2011, the content of which is incorporated into this document for reference. Background of the Invention
[0003] [0003] Recently, in the field of rotor technology, technology, in which a permanent magnet is inserted into a hole portion provided in a rotor core and a liquid resin is filled between the hole portion and the permanent magnet to fix the permanent magnet to the rotor core, has been used. In this field of the art, a urethane resin, an epoxy resin, and the like, are generally employed as the liquid resin. Such technology is described, for example, in PTL 1.
[0004] [0004] In addition, in PTL 2, an epoxy resin used to encapsulate an engine, and a molded article formed by curing it are described. It is described that the properties of working environment, productivity, heat resistance, thermal conductivity, solvent resistance, resistance to high water humidity, and a low coefficient of linear expansion are obtained in the molded article. For this reason, the molded article described in PTL 2 is thought to be used as an engine housing.
[0005] [0005] In addition, the rotor described in PTL 3 has a structure where a second hole portion that communicates with a first hole portion and that is positioned along the direction of rotation of the rotor is formed on the side of the first portion of hole that accommodates a permanent magnet. By filling a resin or spring arrangement in the second hole portion, the stress that the permanent magnet receives from the side wall of the first hole portion in the direction of rotor rotation is reduced, which is described as being able to prevent the permanent magnet from breaking.
[0006] [0006] Incidentally, as a technique used to fill a liquid resin between the hole portion and the rotor core magnet, there are two techniques, a first-in technique and a coating technique. The first-come technique includes the following steps. First, a liquid resin is filled into a hole portion of a rotor core through a dispenser. Subsequently, a magnet is inserted in the hole portions filled with the liquid resin. The first entry technique is described in PTLs 4 and 5. On the other hand, the coating technique includes the following steps. First, the magnet is coated with the liquid resin with a brush. Then, the magnet coated with the liquid resin is inserted into the hole portions of the rotor core. The coating technique is described in PTL 6.
[0007] [0007] [PTL 1] Japanese patent application not examined, first publication number 2007-236020
[0008] [0008] [PTL 2] Japanese patent application not examined, first publication number 2009-13213
[0009] [0009] [PTL 3] Unexamined Japanese patent application, first publication number 2002-359942
[0010] [0010] [PTL 4] Japanese patent application not examined, first publication number 2005-304247
[0011] [0011] [PTL 5] Japanese patent application not examined, first publication number H11-98735
[0012] [0012] [PTL 6] Japanese patent application not examined, first publication number 2003-199303 Summary of the Invention
[0013] [0013] It is difficult to apply the technology described above used to fill a liquid resin to an injection method to inject a resin into a gap between a hole portion of a rotor core and a magnet previously inserted into the hole portion.
[0014] [0014] In addition, the epoxy resin described in PTL 2 is intended to cover the entire engine. Therefore, it is difficult to use the resin described in PTL 2 in order to fix the permanent magnet.
[0015] [0015] Therefore, the present inventors conducted studies and as a result, they discovered that it is possible to fill a resin in a gap between a hole portion of a rotor core and a magnet previously inserted in the hole portion using a molding by insertion.
[0016] [0016] However, in the case where the gap between the hole portion and the rotor core magnet is narrow, there is a risk that a molten resin cannot be filled in the gap. Consequently, the present inventors believe that there is still room for improving the melting viscosity of a solid resin, in order to accentuate its gap filling properties.
[0017] [0017] According to the present invention, a resin fastening composition used to form a rotor fastening element that includes a rotor core that has a laminate formed by laminating a plurality of plate elements and is fixed and installed on a rotary axis, in which a plurality of bore portions arranged along the peripheral portion of the rotary axis is provided in the laminate; a magnet inserted in the hole portions; and a fastener formed by curing the fastening resin composition filled in a separation portion between the bore portion and the magnet, the fastening resin composition which includes a thermoset resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C), in which the ICI viscosity at 150 ° C of the epoxy resin is 3 poises or less, is provided.
[0018] [0018] In accordance with the present invention, a solid fixing resin composition, which has excellent filling properties, and a rotor using the same are provided. Brief Description of Drawings
[0019] [0019] The objectives described above and other objectives, resources and advantages become more apparent with reference to the appropriate modalities, as described later, and to the attached drawings below.
[0020] [0020] Figure 1 is a top view schematically showing a rotor, according to an embodiment of the present invention.
[0021] [0021] Figure 2 is a top view showing schematically a mold used in insertion molding, according to an embodiment of the present invention.
[0022] [0022] Figure 3 is an enlarged view showing schematically a part of a rotor, according to an embodiment of the present invention.
[0023] [0023] Figure 4 is a cross-sectional view showing schematically a part of the rotor, according to an embodiment of the present invention.
[0024] [0024] Figure 5 is a cross-sectional view showing schematically a rotor, according to an embodiment of the present invention.
[0025] [0025] Figure 6 is a top view showing schematically a rotor, according to a modification.
[0026] [0026] Figure 7 is a top view schematically showing a rotor, according to a modification.
[0027] [0027] Figure 8 is a top view showing schematically a rotor, according to a modification. Description of Modalities
[0028] [0028] Later in this document, the modalities of the present invention will be described with reference to the drawings. Incidentally, in all drawings, the same reference numerals are linked to the same components and the explanation of this will not be repeated, as appropriate.
[0029] [0029] Figure 1 is a top view of the rotor, according to an embodiment of the present invention. Figure 3 is an enlarged view of a part of the rotor, according to an embodiment of the present invention. Figure 4 is a cross-sectional view of a part of the rotor, according to an embodiment of the present invention. The rotor 100 of the present embodiment includes a rotor core 110, a magnet 120, and a fastener 130. The rotor core 110 has a laminate formed by laminating a plurality of plate elements (electromagnetic steel plates). The rotor core 110 is fixed and installed on a rotating axis (axis 170). Furthermore, in the rotor core 110, a plurality of bore portions 150 arranged along the peripheral portion of the rotary axis is provided in the laminate. The magnet 120 is inserted into the bore portions 150. The fixture 130 is formed by curing the fixing resin composition, filled in the separation portion between the bore portion 150 and the magnet 120.
[0030] [0030] The rotor core 110 consists of rolling a plurality of electromagnetic steel plates (steel plates 112) which are magnetic bodies in the shape of a thin plate. In the rotor core 110, a through hole for inserting the shaft 170 is provided. This rotor core 110 can be, for example, cylindrical in shape. The shape observed from the upper surface of the rotor core 110 is not particularly limited, however, it can, for example, be circular, polygonal, or the like. In addition, a plurality of electromagnetic steel plates are joined to each other by a caulking portion 160. In addition, the electromagnetic steel plate consists, for example, of iron and iron alloys. In addition, an end plate 114 is provided in the end portion in the axial direction of the rotor core 110. In addition, the grooves 116 to prevent interference with the caulking portion 160 and the opening portion of the filling portion 140 can formed on end plate 114.
[0031] [0031] A plurality of hole portions 150 (or a group of hole portions formed with a plurality of hole portions) is arranged in the rotor core 110 to form the point of symmetry around the center of the axial core of the rotary axis . The number of hole portions 150 is not particularly limited, however, it is, for example, 2n or 3n (where n is a natural number, for example, in the range of 2 to 5). The magnet 120 is inserted into the respective hole portions 150. The hole portions 150 can be configured to adapt to the shape of the magnet 120 and can have a margin (span portion) around the corner of the magnet 120, for example.
[0032] [0032] The layout of the hole portions 150 is not limited to the modality shown in Figure 1, and any of the several layout layouts shown in Figures 6 to 8 can be used. A set of a group of hole portions that includes two or three hole portions 150 can be arranged along the peripheral portion of the rotary axis. As shown in Figure 1, the respective groups of hole portions are separated from each other and can consist of two hole portions arranged in the V shape. Furthermore, as shown in Figure 8, the group of hole portions can be constituted through the hole portions 154a and 154b, and the hole portions 156 formed between these hole portions 154a and 154b. In addition, as shown in Figure 7, the hole portions arranged in a V shape can communicate to form a hole portion 152. In addition, as shown in Figure 6, the hole portions 150 can be arranged so that the bore portions 150 are arranged apart from each other in the position orthogonal to the direction perpendicular to the axis surface.
[0033] [0033] In addition, the magnet 120 can be attached to the inside of the bore portions 150. For example, as shown in Figures 3 and 4, the magnet 120 can be attached to the side wall 151 positioned on the outer peripheral side of the rotor core. 110 on the side wall of the hole portions 150. That is, the side wall 121 of the magnet 120 can be in contact with the side wall 151 of the hole portion 150. In other words, the fixing resin composition, according to the present invention, can be filled in the separation portion (filler portion 140) between a side wall other than the side wall 151 of the hole portions 150 and the magnet 120. This fixing resin composition is cured to form a fixing element 130 The fixing element 130 can be provided between a corner of the hole portion 150 and the magnet 120. Here, for example, a permanent magnet, such as a neodymium magnet, can be used as the magnet 120.
[0034] [0034] In Figures 3 and 4, the side wall 153 represents one positioned on the side of the inner peripheral circle of the rotor core 110 on the side walls of the hole portion 150. Furthermore, the side wall 123 represents one that faces the wall 153 of the hole portion 150 in the side walls of the magnet 120.
[0035] [0035] In the present embodiment, as shown in Figure 3 or 4, the spacing width D1 of a gap in the diameter direction between the hole portion 150 and the magnet 120 in the rotor core 110 is defined as a distance from the side wall 153 from hole portion 150 to side wall 123 of magnet 120. In the case where the gap exists, the spacing width D1 is preferably equal to or greater than 20 µm and equal to or less than 500 µm, and more preferably , equal to or greater than 50 µm and equal to or less than 300 µm. by adjusting this spacing width D1 within the range, the rotor can be provided with good mechanical resistance.
[0036] [0036] The present inventor investigated and, as a result, it was proved that the discharge of resins occurs easily in a region that has a narrow width.
[0037] On the contrary, using the fixing resin composition of the present invention, which has excellent filling properties, the generation of resin discharge can be inhibited in a region that is narrow in width. In this way, since the fastener 130 is well filled in a gap between the hole portion 150 and the magnet 120, the power of the rotor 100 can be improved. Consequently, it reduces the noise generated from the rotor during rotation.
[0038] [0038] As shown in Figure 5, the end plates 118a and 118b can be fixed by welding, or similar, to the axis 170. Furthermore, in the bore portions 150, the fastening element 130 may not be formed in the side wall of the magnet 120 on the outer peripheral side, however, as shown in Figure 5, the fastening element 130 can be formed on both side walls of the magnet 120 on the outer peripheral side and on the inner peripheral side.
[0039] [0039] Hereinafter, the respective components of the fixing resin composition, which constitute the rotor 100 of the present invention, will be described.
[0040] [0040] This fixing resin composition is used to form rotors or the formation of vehicles that are equipped with rotors. That is, the fixing resin composition is used to fix a magnet arranged in the hole portions formed in a rotor core consisting of an electromagnetic steel plate. (Fixing resin composition)
[0041] [0041] The fixing resin composition according to the present invention includes a thermoset resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C). In this fixation resin composition, the ICI viscosity at 150 ° C of the epoxy resin is specified to be 3 poises or less. In addition, for this fixation resin composition, when the fixation resin composition is injected into a flow passage that has a cross-sectional shape with a width of 3 mm and a thickness of 80 µm under the conditions of a temperature of 175C mold, a molding pressure of 6.9 MPa, and an injection time of 20 seconds, the slit flow length is 75 mm or more. Here, the length of the slit flow is preferably equal to or greater than 75 mm and equal to or less than 300 mm, and more preferably equal to or greater than 80 mm and equal to or less than 300 mm. [Thermosetting resin (A)]
[0042] [0042] First, the thermosetting resin (A) will be described.
[0043] [0043] The thermoset resin (A) is not particularly limited, however, an epoxy resin (A1), an oxethane resin, a (meth) acrylate resin, an unsaturated polyester resin, a diallyl phthalate resin, a maleimide resin , or similar, is used. Among these, epoxy resin (A1), which has excellent curing capacity, storage capacity, heat resistance, moisture resistance and chemical resistance of a cured product, is used appropriately.
[0044] [0044] The thermoset resin (A), according to the present invention, includes an epoxy resin (A1). Examples of epoxy resin (A1) include those that have two or more epoxy groups in a molecule.
[0045] [0045] The weight or molecular structure of the epoxy resin is not particularly limited, however, it is preferable that the weight or molecular structure reduces the viscosity of the fixing resin composition. At the ICI viscosity at 150 ° C of the epoxy resin (A1), the upper limit is equal to or less than 3 poises and, preferably, equal to or less than 1.5 poises. The lower limit is not particularly limited, however, it is preferably equal to or greater than 0 poise, and more preferably, equal to or greater than 0.01 poises. Through this, it becomes possible to improve the filling properties of the fixing resin composition and, thus, even in the case where the gap between the hole portion and the magnet is narrow, the contact area between the steel plates and the magnet can be sufficiently maintained. In this way, it is possible to improve the high mechanical strength.
[0046] [0046] In addition, examples of epoxy resin (A1) include epoxy resins of the phenolaralkyl type, such as an epoxy resin of the biphenyl type, an epoxy resin of the phenolaralkyl type which has a biphenylene skeleton, an epoxy resin of the phenolaralkyl type which has a phenylene backbone, a naphtholalkyl type epoxy resin that has a phenylene backbone, and a phenolaralkyl type epoxy resin that has a methoxynaphthalene backbone; bisphenol-type epoxy resins, such as a phenolnovolacepoxy resin, a novolac ortho -resol type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, and an epoxy resin of the bisphenol S type, and an epoxy resin of the tetramethyl bisphenol type; a bisnaftol type epoxy resin, a dicyclopentadiene type epoxy resin, a dihydro anthracenediol type epoxy resin, and a triphenylmethane type epoxy resin.
[0047] [0047] Among these, the epoxy resin (A1) is preferably an epoxy resin that has a crystallinity, such as a biphenyl type epoxy resin and a bisphenol type epoxy resin, as well as a phenolaralkyl type epoxy resin that it has a phenylene skeleton, a phenolaralkyl epoxy resin which has a biphenylene skeleton, and a triphenylmethane epoxy resin. These can be used individually or in combination with two or more of these types.
[0048] [0048] The amount of the thermosetting resin (A), according to the present invention, is not particularly limited, however, it is preferably equal to or greater than 5% by mass and equal to or less than 40% by mass, and more preferably , equal to or greater than 7% by weight and equal to or less than 20% by weight, based on 100% by weight of the total amount of the fixing resin composition.
[0049] [0049] In a preferred embodiment that includes epoxy resin (A1), according to the present invention, the lower limit of the amount of epoxy resin is not particularly limited, however, it is preferably equal to or greater than 70% by weight and equal to or less than 100% by weight, and more preferably equal to or greater than 80% by weight and equal to or less than 100% by weight, based on 100% by weight of the thermosetting resin (A). [Curing agent (B)]
[0050] [0050] below, the curing agent (B) will be described. The curing agent (B) is used to dimensionally bond the epoxy resin (A1) included in the thermoset resin (A). The curing agent (B) is not particularly limited, however, it is preferably one that reduces the viscosity of the fixing resin composition. The curing agent (B) has, for example, an upper limit of viscosity ICI at 150 ° C preferably equal to or less than 2 poises, more preferably equal to or less than 1.8 poises, and even more preferably equal to or less than 1.7 poises. The lower limit is not particularly limited, however, it is preferably equal to or greater than 0 poise, and more preferably, equal to or greater than 0.01 poises.
[0051] [0051] Furthermore, the curing agent (B) can be, for example, a phenolic resin, such as a phenolic resin of the novolac type, a phenolaralkyl resin that has a phenylene skeleton, a phenolaralkyl resin that has a skeleton biphenylene, a naphtholalkyl resin that has a phenylene backbone, a phenolic resin mainly formed from reaction products of hydroxybenzaldehyde, formaldehyde, and phenol, and a copolymer of a phenol compound of the triphenylmethane type and a phenol compound of the novolac type. These can be used individually or in combination with two or more types of these. These phenolic resin based curing agents are preferred from the point of view of obtaining a balance in flame resistance, moisture resistance, electrical properties, curing capacity, storage stability, and the like. In particular, in the term of curability, the hydroxyl group equivalents in the phenolic resin based curing agent can be, for example, equal to or greater than 90 g / eq and equal to or less than 250 g / eq.
[0052] [0052] Furthermore, examples of the curing agent used in combination with others include a polyaddition curing agent, a catalyst curing agent, and a condensing curing agent.
[0053] [0053] Examples of the polyaddition-type curing agent include polyamine compounds that include aliphatic polyamines, such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylenediamine (MXDA), and aromatic polyamines, such as diaminodiphenylmethane (DDM ), m-phenylenediamine (MPDA), and diaminodiphenylsulfone (DDS), as well as, diciandiamides (DICY) and dihydrazides of organic acids; acid anhydrides that include alicyclic acid anhydrides, such as, hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), and aromatic acid anhydrides, such as trimellitic anhydride (TMA), pyromelitic anhydride (PMDA), and benzofenonetronetretronic acid BTDA); polyphenol compounds, such as a novolac-type phenolic resin and a phenol polymer; polymercaptan compounds, such as a polysulfide, a thioester, and a thioether; isocyanate compounds, such as an isocyanate prepolymer and a blocked isocyanate; and organic acids, such as a polyester resin containing carboxylic acid.
[0054] [0054] Examples of catalyst-type curing agent include tertiary amine compounds, such as benzyl dimethylamine (BDMA) and 2,4,6-trisdimethylaminomethylphenol (DMP-30); imidazole compounds, such as, 2-methylimidazole and 2-ethyl-4-methylimidazole (EMI24); and Lewis acids, such as a BF3 complex.
[0055] [0055] Examples of condensation type curing agent include group-containing phenolic resins, such as resolv resins; urea resins, such as a urea resin containing methylol group; and melamine resins, such as a melamine resin containing methylol group.
[0056] [0056] In the case of using such other curing agents in combination with each other, the lower limit of the amount of the curing agent based on phenolic resin is preferably equal to or greater than 20% by weight, more preferably equal or greater than 30% by weight and, particularly preferably, equal to or greater than 50% by weight, based on all curing agent (B). when the mixing ratio is within the above range, good fluidity can be displayed while maintaining flame resistance. In addition, the upper limit of the amount of phenolic resin-based curing agent is not particularly limited, however, it is preferably equal to or less than 100% by weight, based on the entire curing agent (B).
[0057] [0057] The lower limit of the amount of curing agent (B) in the fixing resin composition, according to the present invention, is not particularly limited, however, it is preferably equal to or greater than 3% by weight, and more preferably equal to or greater than 3.5% by weight, based on 100% by weight of the total amount of the fixing resin composition. If the lower limit of the mixing ratio is within the above range, good curing ability is achieved. In addition, the upper limit of the amount of curing agent (B) in the fixing resin composition, according to the present invention, is also not particularly limited, however, it is preferably equal to or less than 35% by weight, and more preferably less than or equal to 15% by weight, based on 100% by weight of the total amount of the entire fixing resin composition.
[0058] [0058] Incidentally, it is preferable that the phenolic resin as the curing agent (B) and the epoxy resin is mixed, so that the equivalent ratio (EP) / (OH) between the number of epoxy groups (EP) in the resin total thermoset (A) and the number of phenolic hydroxyl groups (OH) throughout the phenolic resin is equal to or greater than 0.8 and less than or equal to 1.3. When the equivalent ratio is within the above range, sufficient curing properties can be obtained when molding the obtained fixing resin composition. [Inorganic load (C)]
[0059] [0059] As the inorganic filler (C) used in the fixing resin composition, according to the present invention, the inorganic fillers that are generally used in the field of fixing resin compositions can be used. Examples of these include fused silica, such as fused crushed silica and fused spherical silica; crystalline silica, alumina, kaolin, talc, clay, mica, rock wool, volastonite, glass powder, glass flakes, glass beads, glass fibers, silicon carbide, silicon nitride, aluminum nitride, carbon black , graphite, titanium dioxide, calcium carbonate, calcium sulphate, barium carbonate, magnesium carbonate, magnesium sulphate, barium sulphate, cellulose, aramid, wood, and pulverized powder obtained by spraying cured products of molding of phenolic resin or epoxy molding materials. Among these, silica, such as fused crushed silica, fused spherical silica and crystalline silica are preferably used, and fused spherical silica is more preferably used. In addition, among these, calcium carbonate is preferable in terms of cost. The inorganic filler (C) can be used individually or in combination with two or more of these types.
[0060] [0060] The average particle diameter D50 of the inorganic filler (C) is preferably equal to or greater than 0.01 µm and equal to or less than 75 µm, and more preferably equal to or greater than 0.05 µm and equal to or less at 50 µm. By adjusting the average particle diameter of the inorganic filler (C) within the ranges above, the filling capacity in the separation portion (filling portion) between the hole portion and the magnet is improved. In addition, by adjusting the upper limit of the average particle diameter of the inorganic filler (C) to the upper limit equal to or less than 75 µm, the filling capacity is further improved.
[0061] [0061] The average particle diameter D50 is defined as an average particle diameter of volume conversion by a RODOS SR laser diffraction measuring device (SYMPATEC HEROS & RODOS).
[0062] [0062] In addition, in the fixing resin composition according to the present invention, the inorganic filler (C) can contain two or more types of spherical silica that have different average particle diameters D50. Through this, both the fluidity improvement and the ability to fill and inhibit burr generation can be satisfied.
[0063] [0063] The amount of the inorganic filler (C) is preferably equal to or greater than 50% by weight, more preferably equal to or greater than 60% by weight, even more preferably equal to or greater than 65% by weight and, in a particularly preferred manner, equal to or greater than 75% by weight, based on 100% by weight of the total amount of the fixing resin composition. When the lower limit is within the above ranges, an increase in moisture absorption and a decrease in strength, accompanied by curing of the obtained fixing resin composition, can be reduced. Furthermore, the amount of the inorganic filler (C) is preferably equal to or less than 93% by weight, more preferably equal to or less than 91% by weight, and even more preferably equal to or less than 90% by weight, with based on 100% by mass of the total amount of the fixing resin composition. If the upper limit is within the above ranges, the fixing resin composition obtained has good fluidity, as well as good molding capacity. Therefore, the preparation stability of the rotor increases and, thus, a rotor that has an excellent balance between performance and durability is obtained.
[0064] [0064] In addition, the present inventor investigated and, as a result, by adjusting the amount of the inorganic filler (C) equal to or greater than 50% by mass, the difference in linear expansions between the fastener and the plate electromagnetic steel decreases and, therefore, it has been proven that at varying temperatures, modification of the electromagnetic steel plate and deterioration of rotor rotation properties are inhibited. from this, a rotor that has excellent duration of rotation properties, in particular, between durability, is obtained.
[0065] [0065] Furthermore, in the case where the silica, such as fused crushed silica, fused spherical silica, and crystalline silica is used as the inorganic filler (C), the amount of the silica is preferably equal to or greater than 40 % by weight, and more preferably, equal to or greater than 60% by weight, based on 100% by weight of the total amount of the fixing resin composition. If the lower limit is within the range above, a good balance between fluidity and the rate of thermal expansion is achieved.
[0066] [0066] Incidentally, in the event that a metal hydroxide, such as aluminum hydroxide and magnesium hydroxide, or an inorganic flame retardant, such as zinc borate, zinc molybdate, and antimony trioxide, as described below, it is used in combination with the inorganic filler (C), the total amount of the inorganic flame retardant and the inorganic filler is preferably within the range above the amount of the inorganic filler (C).
[0067] [0067] In addition, in the Examples of the present application, as described later, the sum of the inorganic charge and the inorganic flame retardant, such as aluminum hydroxide is or greater than 80% by mass, based on 100% by mass of the total amount of the fixing resin composition. However, in the present invention, in order to properly adjust the fluidity and linear expansion coefficient, according to the elements used in a rotor, the amount of inorganic filler can be reduced, and the amount of resin material can also be reduced. be increased. [Other Components]
[0068] [0068] The fixing resin composition according to the present invention can include a curing accelerator (D). The curing accelerator (D) can be any one that promotes the reaction between an epoxy group of the epoxy resin and a hydroxyl group of the phenolic resin based curing agent (B), and a curing accelerator (D) generally used can to be used.
[0069] [0069] Specific examples of the cure accelerator (D) include compounds containing phosphorus atom, such as an organic phosphine, a tetra-substituted phosphonium compound, a phosphobetaine compound, a phosphine compound adduct and a compound quinone, and an adduct of a phosphonium compound and a silane compound; nitrogen-containing compounds, typically, such as amidine-based compounds, such as, 1,8-diazabicyclo (5.4.0) undecene-7 and imidazole; tertiary amines, such as benzyldimethylamine; and amidinium salts or ammonium salts, which are quaternary onium salts of the above compounds. Among these, compounds containing phosphorus atom are preferred from the point of view of curability; curing accelerators that have latency, such as a tetra-substituted phosphonium compound, a phosphobetaine compound, a phosphine compound adduct and a quinone compound, and a phosphonium compound adduct and a silane compound they are more preferable from the point of view of a balance between fluidity and healing capacity; and a tetrasubstituted phosphonium compound is particularly preferred in view of fluidity; a phosphobetaine compound, and a adduct of a phosphine compound and a quinone compound is particularly preferred from the viewpoint of weld strength; an adduct of a phosphonium compound and a silane compound is particularly preferred from the point of view of latent curing capacity; a tetra-substituted phosphonium compound is preferred from the point of view of continuous moldability; and an organic phosphine and a nitrogen atom-containing compound are also used appropriately due to cost.
[0070] [0070] Examples of organic phosphine that can be used to form the fixing resin composition according to the present invention include primary phosphines, such as ethylphosphine and phenylphosphine; secondary phosphines, such as, dimethylphosphine and diphenylphosphine; and tertiary phosphines, such as trimethylphosphine, triethylphosphine, tributylphosphine and triphenylphosphine.
[0071] [0071] Examples of the tetra-substituted phosphonium compound that can be used as the fixing resin composition according to the present invention include a compound represented by the following general formula (1).
[0072] [0072] In the general formula (1), P represents a phosphorus atom; R1, R2, R3, and R4 each independently represent an aromatic group or an alkyl group; A represents an anion of an aromatic organic acid in which at least one functional group selected from a hydroxyl group, a carboxyl group, and a thiol group is contained in an aromatic ring; AH represents an aromatic organic acid in which at least one functional group selected from a hydroxyl group, a carboxyl group, and a thiol group is contained in an aromatic ring; x and y are each integer from 1 to 3; z is an integer from 0 to 3; and x = y.
[0073] [0073] The compound represented by the general formula (1) is obtained, for example, in the following way, however, it is not limited to this. First, a tetra-substituted phosphonium halide, an aromatic organic acid, and a base are added to an organic solvent and uniformly mixed to produce an aromatic organic acid anion in the solution system. Subsequently, water is added to the solution and, thus, the compound represented by the general formula (1) can be precipitated. In the compound represented by the general formula (1), R1, R2, R3, and R4 attached to a phosphorus atom are each preferably a phenyl group, AH is preferably a compound that has a hydroxyl group in its aromatic ring, or that is, a phenol compound, and A is preferably an anion of the phenol compound, each from the point of view of an excellent balance between yield during synthesis and the curative-promoting effect. In addition, the phenol compound includes, within its concept, monocyclic phenol, cresol, catechol, resorcin, fused polycyclic naphthol, dihydroxynaphthalene, bisphenol A, bisphenol F, bisphenol S, biphenol, phenylphenol, novolac phenol, and the like, which include a plurality of aromatic (polycyclic) rings, and among these, a phenol compound which has two hydroxyl groups is preferably used.
[0074] [0074] Examples of the phosphobetaine compound that can be used as the fixing resin composition according to the present invention include a compound represented by the following general formula (2).
[0075] [0075] In the general formula (2), X1 represents an alkyl group having 1 to 3 carbon atoms; Y1 represents a hydroxyl group; a is an integer from 0 to 5; and b is an integer from 0 to 4.
[0076] [0076] The compound represented by the general formula (2) is obtained, for example, as follows. First, it is obtained through a step in which a triaromatic-substituted phosphine, which is a tertiary phosphine, is put in contact with a diazonium salt to replace the triaromatic-substituted phosphine and a diazonium group of the diazonium salt, but it is not limits it to this.
[0077] [0077] Examples of the adduct of a phosphine compound and a quinone compound that can be used as the fixing resin composition according to the present invention include a compound represented by the following general formula (3).
[0078] [0078] In the general formula (3), P represents a phosphorus atom; R5, R6, and R7 each independently represent an alkyl group that has 1 to 12 carbon atoms or an aryl group that has 6 to 12 carbon atoms; R8, R9, and R10 each independently represent a hydrogen atom or a hydrocarbon group that has 1 to 12 carbon atoms; and R8 and R9 can be connected to each other to form a ring.
[0079] [0079] Preferable examples of the phosphine compound used to form the adduct of a phosphine compound and a quinone compound include triphenylphosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, trinafylphosphine, and tris (benzyl) phosphine, each one of which contains an unsubstituted aromatic ring or an aromatic ring that has a substituent, such as an alkyl group or an alkoxy group. Examples of the substituent, such as an alkyl group and an alkoxy group include those having 1 to 6 carbon atoms. From the point of view of easy availability, triphenylphosphine is preferable.
[0080] [0080] Furthermore, examples of the quinone compound used to form the adduct of a phosphine compound and a quinone compound include o-benzoquinone, p-benzoquinone, and anthraquinones, and among these compounds, p-benzoquinone is preferable from from the point of view of storage stability.
[0081] [0081] In a method of producing an adduct of a phosphine compound and a quinone compound, an organic tertiary phosphine is brought into contact with a benzoquinone in a solvent that can dissolve both organic tertiary phosphine and benzoquinone, and mixed to produce such an adduct. Any solvent that has a low solubility of the adduct therein, such as ketones, such as acetone and methyl ethyl ketone, can be used, however, it is not limited to this.
[0082] [0082] In the compound represented by the general formula (3), R5, R6, and R7, all of which are attached to a phosphorus atom, are preferably a phenyl group, and R8, R9, and R10 are each preferably a hydrogen atom. That is, a compound produced by adding 1,4-benzoquinone in triphenylphosphine is preferable, because the compound decreases the modulus of elasticity when heating a cured product of the fixing resin composition.
[0083] [0083] Examples of the adduct of a phosphonium compound and a silane compound, which can be used to form the fixing resin composition according to the present invention, include a compound represented by the following general formula (4).
[0084] [0084] In the general formula (4), P represents a phosphorus atom; Si represents a silicon atom; R11, R12, R13, and R14 each independently represent an organic group that has an aromatic ring or a heterocycle, or an aliphatic group; X2 is an organic group that binds to groups Y2 and Y3; X3 is an organic group that is linked to groups Y4 and Y5; Y2 and Y3 each independently represent a group formed when a proton donor group releases a proton, and groups Y2 and Y3 on the same molecule are attached to the silicon atom to form a chelate structure; Y4 and Y5 each independently represent a group formed when a proton donor group releases a proton, and groups Y4 and Y5 on the same molecule are attached to the silicon atom to form a chelate structure; X2 and X3 can be the same or different from each other; Y2, Y3, Y4, and Y5 can be the same or different from each other; and Z1 is an organic group that has an aromatic ring or a heterocycle, or an aliphatic group.
[0085] [0085] In the general formula (4), the examples of R11, R12, R13, and R14 include a phenyl group, a methylphenyl group, a methoxyphenyl group, a hydroxyphenyl group, a naphthyl group, a hydroxynaphthyl group, a benzyl group, a methyl group, an ethyl group, an n-butyl group, an n-octyl group, and a cyclohexyl group. Among these, aromatic groups that have a substituent and unsubstituted aromatic groups, such as a phenyl group, a methylphenyl group, a methoxyphenyl group, a hydroxyphenyl group, and a hydroxynaphthyl group are more preferable.
[0086] [0086] Furthermore, in the general formula (4), X2 is an organic group that binds to Y2 and Y3. Similarly, X3 is an organic group that is linked to groups Y4 and Y5. Y2 and Y3 are each a group formed when a proton donor group releases a proton, and groups Y2 and Y3 on the same molecule are attached to the silicon atom to form a chelate structure. Similarly, Y4 and Y5 are each a group formed when a proton donor group releases a proton, and groups Y4 and Y5 on the same molecule are attached to the silicon atom to form a chelate structure. Groups X2 and X3 can be the same or different from each other, and groups Y2, Y3, Y4, and Y5 can be the same or different from each other. The group represented by —Y2-X2-Y3- and the group represented by —Y4-X3-Y5-in the general formula (4) are each, a group formed when a proton donor releases two protons. Like the proton donor, an organic acid that has at least two carboxyl groups or hydroxyl groups in the molecule is preferable, an aromatic compound that has at least two carboxyl groups or hydroxyl groups on the carbon that makes up the aromatic ring is more preferable, and one aromatic compound having at least two hydroxyl groups on the adjacent carbon that forms the aromatic ring is even more preferable. Examples of these include catechol, pyrogallol, 1,2-dihydroxinaphthalene, 2,3-dihydroxinaphthalene, 2,2′-biphenol, 1,1′-bi-2-naphthol, salicylic acid, 1-hydroxy-2- naphthoic, 3-hydroxy-2-naphthoic acid, chloranilic acid, tannic acid, 2-hydroxybenzyl alcohol, 1,2-cyclohexanediol, 1,2-propanediol, and glycerin. Among these, catechol, 1,2-dihydroxinaphthalene and 2,3-dihydroxinaphthalene are more preferred from the point of view of a balance between the high availability of raw materials and a curing-promoting effect.
[0087] [0087] In addition, in the general formula (4), Z1 represents an organic group that has an aromatic ring or a heterocycle, or an aliphatic group. Specific examples of these include aliphatic hydrocarbon groups, such as, a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, and an octyl group; aromatic hydrocarbon groups, such as a phenyl group, a benzyl group, a naphthyl group, and a biphenyl group; and reactive substituents, such as, a glycidyloxypropyl group, a mercaptopropyl group, an aminopropyl group, and a vinyl group. Among these, a methyl group, an ethyl group, a phenyl group, a naphthyl group, and a biphenyl group are more preferable from the point of view of thermal stability.
[0088] [0088] In a method of producing an adduct of a phosphonium compound and a silane compound, a silane compound, such as phenyltrimethoxysilane and a proton donor, such as, 2,3-dihydroxynaphthalene are added to methanol in a bottle and dissolved. Then, a sodium methoxide-methanol solution is added by dripping under stirring at room temperature. A solution prepared by dissolving a tetrasubstituted phosphonium halide, such as tetrafenyl phosphonium bromide in methanol, is previously added by dripping to the resulting reaction product under stirring at room temperature to precipitate crystals. The precipitated crystals are filtered, washed with water and then vacuum dried to obtain a adduct of a phosphonium compound and a silane compound. However, the method is not limited to this.
[0089] [0089] The lower limit of the amount of curing accelerator (D) that can be used as the fixing resin composition according to the present invention is preferably equal to or greater than 0.1% by weight, based on by 100% by mass of the total amount of the fixing resin composition. If the lower limit of the curing accelerator quantity (D) is within the above range, sufficient curing capacity can be obtained. In addition, the upper limit of the amount of the curing accelerator (D) is preferably less than or equal to 3% by weight, and more preferably less than or equal to 1% by mass, based on 100% by mass of the total value of the entire fixing resin composition. If the upper limit of the curing accelerator quantity (D) is within the above range, sufficient fluidity can be obtained.
[0090] [0090] In the fixing resin composition of the present invention, a compound (E) in which a hydroxyl group is attached to each two or more adjacent carbon atoms that form an aromatic ring (later in this document sometimes referred to as the " compound (E) ") can be additionally included. For compound (E) in which a hydroxyl group is attached to every two or more adjacent carbon atoms that make up an aromatic ring, it is used, even in the case of using a curing accelerator containing phosphorus atom that has no latency like the curing accelerator (D) used to accelerate a crosslinking reaction between the epoxy resin (A1) and the phenolic resin based curing agent (B), the reaction of the fixing resin composition during melt kneading can be suppressed with the use of compound (E), so that a fixing resin composition can be obtained in a stable manner. In addition, compound (E) also has an effect of decreasing the melting viscosity of the fixing resin composition and increasing fluidity. Examples of compound (E) include a monocyclic compound represented by the following general formula (5), a polycyclic compound represented by the following general formula (6), and the like, and these compounds may have a substituent other than a hydroxyl group.
[0091] [0091] In the general formula (5), R15 or R19 is a hydroxyl group, when one between R15 and R19 is a hydroxyl group, the other is a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group; and R16, R17, and R18 are each, a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group.
[0092] [0092] In the general formula (6), R20 or R26 is a hydroxyl group, when one between R20 and R26 is a hydroxyl group, the other is a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group; and R21, R22, R23, R24, and R25 are each, a hydrogen atom, a hydroxyl group, or a different substituent from a hydroxyl group.
[0093] [0093] In addition, specific examples of the monocyclic compound represented by the general formula (5) include catechol, pyrogallol, gallic acid, a gallic acid ester, and a derivative thereof. In addition, specific examples of the polycyclic compound represented by the general formula (6) include 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and a derivative thereof. Among these compounds, from the point of view of ease of fluidity control and curability, a compound in which a hydroxyl group is attached to each of the two adjacent carbon atoms that constitute an aromatic ring is preferred. In addition, from the point of view of volatilization in a kneading step, more preferably, used is a compound that has, as a mother core, a naphthalene ring, which has low volatility and high weight stability. In this case, compound (E) can be specifically, for example, a compound that has a naphthalene ring, such as 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and a derivative thereof. These compounds (E) can be used individually or in combination with two or more of these types.
[0094] [0094] The lower limit of the amount of compound (E) is equal to or greater than 0.01% by weight, more preferably, equal to or greater than 0.03% by weight, and particularly preferably, equal to or greater than 0 , 05% by weight, based on 100% by weight of the entire fixing resin composition. If the lower limit of the amount of compound (E) is within the above range, the effects of sufficient low viscosity and fluidity enhancement of the fixing resin composition are obtained. In addition, the upper limit of the amount of compound (E) is equal to or less than 2% by weight, more preferably, equal to or less than 0.8% by weight, and particularly preferably equal to or less than 0.5% by weight. mass, based on 100% by mass of the entire fixing resin composition. If the upper limit of the amount of compound (E) is within the above range, there is little risk of a reduction in the curing capacity and a reduction in the physical properties of curable products.
[0095] [0095] In the fixing resin composition according to the present invention, a coupling agent (F), such as a silane coupling agent, can be added to improve the adhesion between the epoxy resin (A1) and the inorganic charge (C). The coupling agent (F) is any one that undergoes a reaction between the epoxy resin (A1) and the inorganic filler (C) to improve the interfacial strength between the epoxy resin (A1) and the inorganic filler (C), and not it is particularly limited. Examples of these include epoxysilane, aminosilane, ureidosilane, and mercaptosilane. Furthermore, when the coupling agent (F) can be used in combination with the aforementioned compound (E) to increase the effect of the compound (E) to reduce the melt viscosity of the fixing resin composition and improve fluidity.
[0096] [0096] Examples of epoxysilane include γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. In addition, examples of aminosilane include γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N-phenyl γ-aminopropyltriethoxy -β (aminoethyl) γ-aminopropyltriethoxysilane, N-6- (aminoexyl) -3-aminopropyltrimethoxysilane, and N- (3- (trimethoxysilylpropyl) -1,3-benzenodimethanane. In addition, examples of ureidossilane include γ-ureidopropyltriethoxysilane and hexamethysilane and hexamethysilane. A product formed by reacting the primary amino site of aminosilane with ketones or aldehydes can be used as a latent aminosilane coupling agent, in addition, aminosilane can have a secondary amino group, and examples of mercaptosilane include γ-mercaptopropyltrimethoxysilane and 3-mercaptopropylmethyldimethoxysilane, as well as silane coupling agents that exhibit the same function as a pyrolysis mercapto silane coupling agent, t such as, bis (3-triethoxysilylpropyl) tetrasulfide and bis (3-triethoxysilylpropyl) disulfide. In addition, this silane coupling agent can be mixed after being previously subjected to a hydrolysis reaction. These silane coupling agents can be used individually or in combination with two or more of these types.
[0097] [0097] From the point of view of continuous molding capacity, mercaptosilane is preferable; from the point of view of fluidity, aminosilane is preferable; and from an adhesion point of view, epoxysilane is preferable.
[0098] [0098] The lower limit of the amount of the coupling agent (F) that can be used as the fixing resin composition, according to the present invention, is preferably equal to or greater than 0.01% by weight, more preferably , equal to or greater than 0.05% by weight, and particularly preferably equal to or greater than 0.1% by weight, based on 100% by weight of the entire fixing resin composition, according to the present invention. . If the lower limit of the amount of coupling agent (F), such as a silane coupling agent, is within the above ranges, good resistance to vibration is obtained without reducing the interfacial resistance between the epoxy resin (A1) and the inorganic charge (C). Furthermore, the upper limit of the amount of the coupling agent (F), such as a silane coupling agent, is preferably less than or equal to 1% by weight, more preferably less than or equal to 0.8% by weight, and particularly preferably, equal to or less than 0.6% by weight, based on 100% by weight of all fixing resin composition, according to the present invention. If the upper limit of the quantity of the coupling agent (F), such as a silane coupling agent, is within the above range, good resistance to vibration is obtained without reducing the interfacial resistance between the epoxy resin (A1) and the inorganic charge (C). In addition, if the amount of the coupling agent (F), such as a silane coupling agent, is within the above range, good rust resistance is obtained without increasing the water absorption of the cured product of the resin composition. fixation.
[0099] [0099] An inorganic flame retardant (G) can be added to the fixing resin composition, according to the present invention, to improve the flame retardancy. Among these, a metal hydroxide or a composite metal hydroxide that can inhibit the combustion reaction through dehydration and heat absorption during combustion is preferable because the combustion time can be reduced. Examples of metal hydroxide include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, barium hydroxide, and zirconium hydroxide. The composite metal hydroxide can be a hydrotalcite compound containing two or more types of metal elements, where at least one metal element is magnesium, and other elements are elements selected from calcium, aluminum, tin, titanium, iron , cobalt, nickel, copper and zinc. As such a composite metal hydroxide, a solid magnesium / zinc hydroxide solution is readily available commercially. Among these, aluminum hydroxide, a solution of magnesium hydroxide / solid zinc is preferable from the point of view of continuous molding capacity. Inorganic flame retardants (G) can be used individually or in combination with two or more of these types. In addition, in order to reduce the negative effects of continuous molding ability, use can be made with a surface treatment that uses, for example, silicon compounds, such as a silane coupling agent or aliphatic compounds, such as , a wax.
[0100] [00100] The amount of the inorganic flame retardant (G) according to the present invention is preferably equal to or greater than 1% by weight and equal to or less than 20% by weight, and more preferably equal to or greater than 3% by weight and less than or equal to 10% by weight, based on 100% by weight of the total amount of the fixing resin composition according to the present invention.
[0101] [00101] In the fixing resin composition, according to the present invention, the upper limit of the concentration of ionic impurities is preferably equal to or less than 500 ppm, more preferably, equal to or less than 300 ppm, and even more preferably, equal to or less than 200 ppm, based on the fixing resin composition. The lower limit of the concentration of ionic impurities is not particularly limited, however, it is preferably equal to or greater than 0 ppb, more preferably equal to or greater than 10 ppb, and even more preferably equal to or greater than 100 ppb, based on fixing resin composition according to the present invention. In this way, when the cured product of the fixing resin composition according to the present invention is used to form the fixing element, the high resistance to rust can be maintained even with a treatment under a high temperature and a high humidity. .
[0102] [00102] Ionic impurities according to the present invention are not particularly limited, however, examples of these include alkali metal ions, alkaline earth metal ions, and halogen ions, and more specifically, sodium ions and ions chlorine. The upper limit of the concentration of sodium ions is preferably less than or equal to 100 ppm, more preferably less than or equal to 70 ppm, and even more preferably less than or equal to 50 ppm, based on the fixing resin composition, according to the present invention. In addition, the upper limit of the concentration of chlorine ions is preferably less than or equal to 100 ppm, more preferably less than or equal to 50 ppm, and even more preferably less than or equal to 30 ppm, based on the resin composition of fixation according to the present invention. By adjusting the above range, corrosion of the electromagnetic steel plate or magnet can be inhibited.
[0103] [00103] In the present modality, using, for example, an epoxy resin that has high purity, ionic impurities can be reduced. In this way, a rotor that has excellent durability is obtained.
[0104] [00104] The concentration of ionic impurities can be determined as follows. First, the fixing resin composition according to the present invention is molded and cured at 175 ° C for 180 seconds and then sprayed by a spray machine to obtain the powder of a cured product. The powder obtained from the cured product is treated at 120 ° C for 24 hours in pure water and the ions are extracted in pure water. Then, the concentration of ionic impurities can be measured by Inductively Coupled Plasma Mass Spectrometry (ICP-MS).
[0105] [00105] In the fixing resin composition according to the present invention, the upper limit of the amount of alumina is preferably equal to or less than 10% by weight, more preferably equal to or less than 7% by weight, and more preferably less than or equal to 5% by weight, based on 100% by weight of the total amount of the fixing resin composition. The lower limit of the amount of alumina is not particularly limited, however, it is preferably, for example, equal to or greater than 0% by mass, more preferably equal to or greater than 0.01% by mass, and even more preferably equal to or greater than 0.1% by weight, based on 100% by weight of the total amount of the fixing resin composition according to the present invention. By adjusting the amount of alumina to or below the upper limit, the improvement of fluidity and reduction in weight and size of the fixing resin composition, according to the present invention, can be obtained. In addition, in the present mode, 0% by mass allows a value within a detection limit.
[0106] [00106] In the fixation resin composition according to the present invention, in addition to the components described above, ion scavengers, such as hydrotalcites and hydrated oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium ; colorants, such as carbon black, red iron oxide, and titanium oxide; natural waxes, such as a carnauba fence; synthetic waxes, such as a polyethylene wax; releasing agents, such as, higher fatty acids and metal salts thereof, such as, stearic acid and zinc stearate, or paraffin; and low voltage agents, such as, a polybutadiene compound, an acrylonitrile-butadiene copolymerization compound, and silicone compounds, such as, silicone oil and silicone rubber; or similar, can be appropriately incorporated.
[0107] [00107] The amount of the colorant according to the present invention is preferably equal to or greater than 0.01% by weight and equal to or less than 1% by weight, and more preferably equal to or greater than 0.05% by weight and equal to or less than 0.8% by weight, based on 100% by weight of the total amount of the fixing resin composition, according to the present invention. By adjusting the amount of the colorant within the above range, a step of removing the colored impurities is not required, and thus, the workability is improved. Therefore, a rotor that has a high yield is obtained.
[0108] [00108] For the amount of the release agent according to the present invention, based on 100% by mass of the total amount of the fixing resin composition, according to the present invention, the lower limit is not particularly limited, however, this is preferably, for example, equal to or greater than 0.01% by weight, and more preferably, equal to or greater than 0.05% by weight, whereas the upper limit is, for example, preferably less than or equal to 1% by mass, more preferably, equal to or less than 0.5% by mass, even more preferably, equal to or less than 0.2% by mass, and particularly preferably, equal to or less than 0.1% by mass . Generally, if a semiconductor chip is molded by transfer, it is known that adding a certain amount of a release agent keeps the release of a fastener from a mold. However, if the amount of release agent addition is too high, the adhesion between the fastener and the electromagnetic steel plate can be reduced. Thus, in the present invention, the amount of the release agent is preferably low, and particularly preferably, equal to or less than 0.2% by weight. From this, the adhesiveness between the fastening element and the electromagnetic steel plate can be increased and, thus, a rotor that has excellent durability is obtained.
[0109] [00109] The amount of the low voltage agent according to the present invention is preferably equal to or greater than 0.01% by weight and equal to or less than 3% by mass, and more preferably equal to or greater than 0 , 05% by weight and equal to or less than 2% by weight, based on 100% by weight of the total amount of the fixing resin composition, according to the present invention.
[0110] [00110] Using the fixing resin composition of the present invention, configured as described above, it becomes possible to improve the filling properties of the fixing resin composition. In addition, even if the gap between the hole portion and the magnet is narrow, the contact area between the steel plates and the magnet can be sufficiently maintained. As a result, it becomes possible to improve the rotor with high mechanical strength. In addition, even when the fixing resin composition is immersed in Automatic Transmission Fluid (ATF), the rate of change in weight and the rate of change in volume between before and after immersion can be reduced and thus the Fixing resin composition has very suitable characteristics like a rotor used in automobiles. In the fixing resin composition according to the present invention, when the fixing resin composition is injected into a flow passage that has a cross-sectional shape with a width of 3 mm and a thickness of 80 µm under the conditions of a mold temperature of 175 ° C, a molding pressure of 6.9 MPa, an injection time of 20 seconds, and a cure time of 90 seconds, the lower limit of the slit flow length is preferably equal to or greater than 75 mm, more preferably equal to or greater than 80 mm, and even more preferably equal to or greater than 85 mm, while the upper limit is preferably equal to or less than 300 mm. By adjusting the gap length that has a thickness of 80 µm to be equal to or greater than the lower limit, the gap filling properties in a region that has a narrow width can be increased. In addition, when adjusting the gap length that has a thickness of 80 µm to equal or less than the upper limit, a large amount of burr is adhered to the rotor. As a result, when the rotor is spun, deburring occurs, and thus it becomes possible for burrs to inhibit the suppression of rotor rotation.
[0111] [00111] Furthermore, in the present embodiment, for example, the slit flow length can be increased, for example, by reducing the particle diameter of a filler, or by reducing the softening point of the epoxy resin or curing agent , or by reducing the amount of a cure accelerator.
[0112] [00112] In Koka-type viscosity (a Koka-type viscosity is a melting viscosity measured by a Koka-type flow tester (a constant-load orifice flow tester)) of the fixing resin composition according to the present invention, as measured at a measuring temperature of 175 ° C and a load of 10 kg using a Koka viscosity measuring device, the lower limit is not particularly limited, but is preferably equal to or greater than 3 Pa · s, preferably equal to or greater than 5 Pa · s, and even more preferably equal to or greater than 6 Pa · s, while the upper limit is not particularly limited, but is preferably less than or equal to 50 Pa · s, more preferably equal to or less than 30 Pa · s , and even more preferably less than or equal to 15 Pa · s. If the Koka viscosity is equal to or greater than the lower limit, the generation of voids due to drag or similar during molding can be inhibited, while if the Koka viscosity is equal to or less than the upper limit, a filling capacity satisfactory can be obtained. Thus, a rotor that has excellent preparation stability is obtained.
[0113] [00113] Furthermore, in the present embodiment, the Koka-type Viscosity can be reduced, for example, by reducing the softening point of the epoxy resin or curing agent, using a latent curing accelerator, or using fused spherical silica as a filler .
[0114] [00114] The gel time of the fixing resin composition according to the present invention at 175 ° C is preferably equal to or greater than 10 seconds and equal to or less than 50 seconds, and more preferably equal to or greater than 15 seconds and equal or less than 45 seconds. If the gel time is equal to or greater than the lower limit, the filling capacity can be improved, while if the gel time is equal to or less than the upper limit, the molding cycle can be accelerated.
[0115] [00115] Incidentally, in the present modality, the gel time can be reduced, for example, by increasing the amount of the curing accelerator. Thus, a rotor that has excellent preparation stability is obtained.
[0116] [00116] The spiral flow of the fixing resin composition according to the present invention is preferably equal to or greater than 50 cm, more preferably equal to or greater than 60 cm, and even more preferably equal to or greater than 80 cm. If the spiral flow is equal to or greater than the lower limit, the filling capacity, in particular the filling capacity in the vertical direction can be increased. The upper limit of the spiral flow is not particularly limited, but is preferably less than or equal to 250 cm, and more preferably less than or equal to 220 cm. Thus, a rotor that has excellent preparation stability is obtained.
[0117] [00117] Incidentally, in the present embodiment, the spiral flow can be increased, for example, using fused spherical silica as a filler, reducing the softening point of the epoxy resin or curing agent, or reducing the amount of the curing accelerator.
[0118] [00118] When the curing torque of the fixing resin composition according to the present invention is measured over time at a measurement temperature of 175 ° C using a viscoelasticity meter, the curing torque value in 60 seconds after the start of the measurement is set to T60 and the maximum cure torque value up to 300 seconds after the start of the measurement is set to Tmax, the ratio of the cure torque value in 60 seconds after the start of the measurement to the value of maximum curing torque up to 300 seconds after the start of measurement, T60 / Tmax (%), is preferably equal to or greater than 40%, more preferably equal to or greater than 45%, and even more preferably equal to or greater than 50%. The upper limit of the ratio of the curing torque values is not particularly limited, but is preferably less than or equal to 100%, and more preferably less than or equal to 95%. If the ratio of the cure torque values is equal to or greater than the lower limit, the increase in productivity can be expected.
[0119] [00119] Incidentally, in the present modality, the ratio of the cure torque values can be increased, for example, by increasing the amount of the cure accelerator. Thus, a rotor that has excellent preparation stability is obtained.
[0120] [00120] For the fixing resin composition according to the present invention, first, a curable product of the dumbbell-shaped fixing resin composition obtained under the curing conditions of a mold temperature of 175 ° C, a pressure injection rate of 9.8 MPa, and a cure time of 120 seconds, and according to JIS K7162 is manufactured. The curable product of the dumbbell-shaped fixing resin composition is cured under conditions of 175 ° C and 4 hours to manufacture a test piece. The test piece is subjected to a tensile test under the conditions of a temperature of 25 ° C and a loading speed of 1.0 mm / min. to obtain breaking energy. In addition, the same shape as the dumbbell shape described in JIS K7162 is described in ISO527-2.
[0121] [00121] Hereinafter, the breaking energy obtained when the tensile test is performed under the conditions of a temperature of 25 ° C and a loading speed of 1.0 mm / min is defined as the breaking energy a. In addition, the burst energy is obtained when the tensile test is performed under the conditions of a temperature of 150 ° C and a loading speed of 1.0 mm / min is defined as the burst energy b. In addition, the breaking strength under the condition of measuring the breaking energy a is defined as the breaking strength a, and the breaking strength under the condition of measuring the breaking strength b is defined as the breaking strength b.
[0122] [00122] The rupture energy is calculated by making a curve (stress-strain curve) represented by a graph of the relationship between the vertical stress and the vertical strain in the tensile test.
[0123] [00123] Specifically, when adopting the strain as a variable, the integral value of the stress from a starting point to a breaking point in the tensile test is calculated. Higher breaking energy indicates that the obtained rotor core has hardness and toughness, and durability is excellent. In addition, the unit is × 10-4 J / mm3.
[0124] [00124] The breaking energy a in the curable product (fixing element) of the fixing resin composition according to the present invention is preferably equal to or greater than 1.5 × 10-4 J / mm3. With the breaking energy in this range, a rotor core that has excellent durability, including hardness and toughness, is obtained.
[0125] [00125] In addition, the breaking energy a is more preferably equal to or greater than 1.9 × 10-4 J / mm3. With the breaking energy in this range, a rotor core that exhibits sufficient durability can be obtained under an environment for rotation at a high speed at a high temperature over a long period of time. In addition, the upper limit is not particularly limited, but approximately 15.0 × 10-4 J / mm3 may be sufficient.
[0126] [00126] Furthermore, the breaking energy b is preferably equal to or greater than 1.2 × 10-4 J / mm3. In the case where the rupture energy b, measured at a higher temperature as compared to the rupture energy a, is within the above ranges, a rotor that is resistant to changes in temperature and that has excellent durability, including hardness and toughness, can be obtained. In addition, the burst energy b is more preferably equal to or greater than 1.5 × 10-4 J / mm3. With the breaking energy b in this range, the durability during rotation at a high speed is additionally increased. Similarly to rupture energy a, the upper limit of rupture energy b is also not particularly limited, but approximately 8.0 × 10-4 J / mm3 may be sufficient.
[0127] [00127] To increase the breaking energy a and b, the following technique can be effective.
[0128] [00128] First, using a combination of the epoxy resin and the curing agent according to the present invention, the strength and toughness of the resin component can be increased. Furthermore, it is preferable that the surface of the inorganic filler is modified by a silane coupling agent and the interfacial adhesion resistance between the resin and the inorganic filler can be increased. Furthermore, it is more preferable that a particle diameter distribution of the inorganic filler is adjusted to form a structure, in which micro-cracks generated in the inner part of the cured resin product do not proceed easily.
[0129] [00129] The rotor according to the present modality makes it possible to increase the durability by controlling the breaking strength of the curable product (fixing element) of the fixing resin composition according to the present invention at or above 50 MPa . Specifically, with the breaking strength in this range, the durability during rotation at a high speed is additionally increased. In addition, the breaking strength a is preferably equal to or greater than 60 MPa. The upper limit is not particularly limited, but approximately 200 MPa will be sufficient.
[0130] [00130] Also, similarly to the breaking strength a, for the breaking strength b of the curable product of the fixing resin composition according to the present invention, by controlling the breaking strength b to a range equal to or greater than 15 MPa, the durability during a high speed rotation is additionally increased. In addition, the breaking strength b is preferably equal to or greater than 20 MPa. The upper limit is not particularly limited, but about 100 MPa will be sufficient.
[0131] [00131] By adjusting the breaking strength a and b to the ranges specified above, a rotor that has excellent durability can be provided. In particular, a rotor that has excellent permanent magnet position stability when using the rotor during a high speed rotation can be provided.
[0132] [00132] For the fixing resin composition according to the present invention, the fixing resin composition is injection molded under the conditions of a mold temperature of 175 ° C, an injection pressure of 9.8 MPa, and a curing time of 120 seconds, using a mold device to prepare a molded product of the fixing resin composition, which is 80 mm long, 10 mm wide, and 4 mm thick. The molded product is cured under the conditions of 175 ° C and 4 hours to prepare a curable product. Then, the curable product is immersed in ATF at 150 ° C for 1000 hours. When the weight of the curable product before immersion in ATF is defined as X1 and the weight of the curable product after immersion in ATF is defined as X2, the rate of change [%] of the weight is calculated by (X2-X1) / X1 × 100.
[0133] [00133] Here, ATF is not particularly limited as the one generally used, and various additives can be mixed in a base oil. The base oil as mentioned here is commonly base oil based on mineral oil, a base oil based on synthetic oil, or a mixture of these. Examples of the additive component include a viscosity modifier and a friction modifier.
[0134] [00134] In the present modality, such as the ATF used to measure the rate of weight change, for example, Matic Fluid D (manufactured by Nissan Motor Co., Ltd.), Automatic Fluid Type T-IV (manufactured by Toyota Motor Corporation ), ATF DW-1 (manufactured by Honda R&D Co., Ltd.), or the like can be used.
[0135] [00135] For the fixing resin composition according to the present invention, the rate of change in weight when the curable product (fixing element) is immersed in ATF at 150 ° C for 1000 hours is preferably equal to or less than 0 , 5%, and more preferably less than or equal to 0.2%. When the rate of change in weight between before and after immersion in ATF is equal to or less than the upper limit, even when the fastener is in contact with a lubricating oil at a high temperature for a long period of time, the element of fixation can be inhibited from being extremely swollen by the lubricating oil.
[0136] [00136] Furthermore, for the fixing resin composition according to the present invention, the rate of change in weight when the curable product is immersed in ATF at 150 ° C for 1000 hours is preferably equal to or greater than -0.05 %, and more preferably equal to or greater than -0.03%. When the rate of change in weight between before and after immersion in ATF is equal to or greater than the lower limit, even when the fastener is in contact with a lubricating oil at a high temperature for a long period of time, a part of the fastening element can be prevented from flowing into the lubricating oil. In addition, when the rate of change in weight between before and after immersion in ATF is equal to or greater than the lower limit, the characteristics of the lubricating oil can be inhibited from being deteriorated.
[0137] [00137] Therefore, when the rate of change of weight between before and after immersion in ATF is within the above range, the size of the fastener can be kept constant under the environment for rotation at a high speed and at a high temperature over a long period of time. As a result, since the position of the magnet can be kept constant over a long period of time, a rotor that has excellent long-term reliability can be obtained.
[0138] [00138] Furthermore, in the case where the curable product of the fixing resin composition according to the present invention is immersed in ATF at 150 ° C for 2000 hours, when the weight of the curable product after immersion in ATF is defined as X3 , the rate of change [%] of the weight calculated by (X3-X1) / X1 × 100 is preferably equal to or greater than - 0.1% and equal to or less than 0.6%, and more preferably equal to or greater than - 0.07% and less than or equal to 0.5%. If the rate of change in weight as measured under conditions is within the above ranges, a rotor that has excellent long-term reliability can be obtained even under the rotating environment at a high speed and at a high temperature over a long period of time. time.
[0139] [00139] Furthermore, in the case where the curable product of the fixing resin composition according to the present invention is immersed in ATF at 150 ° C for 1000 hours, when the volume of the curable product before immersion in ATF is defined as Y1 and the volume of the curable product after immersion in ATF is defined as Y2, the rate of change [%] of the volume calculated by (Y2-Y1) / Y1 × 100 is preferably equal to or greater than -0.2% and equal to or less than 1.5%, and more preferably equal to or greater than -0.1% and equal to or less than 1%. If the volume change rate measured under the conditions is within the above ranges, a rotor that has excellent long-term reliability can be obtained even under the rotating environment at a high speed and at a high temperature for a long period of time. .
[0140] [00140] The fixing resin composition according to the present invention can be uniformly mixed at normal temperature using, for example, a mixer, and then, if necessary, kneaded by melting using a kneading machine like a heating roller, a kneader, and an extruder, and subsequently, if necessary, cooled and pulverized, to adjust to a desired degree of dispersion and fluidity, or the like.
[0141] [00141] The method of preparing the fixing resin composition according to the present invention is not particularly limited, but can be carried out as follows.
[0142] [00142] First, a thermosetting resin (A), a curing agent based on phenolic resin (B), and an inorganic filler (C), and preferably other additives or the like are mixed in predetermined amounts to obtain a resin composition fastening. Then, the mixture is uniformly sprayed and mixed at normal temperature using, for example, a mixer, a jet mill, a ball mill, or the like, and then kneaded by melting using a kneading machine like a heating roller, a kneader, and an extruder while heating the fixing resin composition to approximately 90 ° C to 120 ° C. Then, the fixing resin composition after kneading is cooled and pulverized to obtain a solid fixing resin composition in the form of granules or powder. The particle size of the powder or granule of the fixing resin composition according to the present invention is preferably, for example, equal to or less than 5 mm. By adjusting the particle size to equal or less than 5 mm, the generation of filling failure during the formation of tablets or the increased imbalance in the mass of the tablet can be inhibited.
[0143] [00143] Furthermore, the powder or granule of the obtained fixing resin composition can be molded into a tablet to obtain a tablet. As a device used in tablet molding, a rotary tablet forming machine of the single shot or multiple communication type can be used. The shape of the tablet is not particularly limited, but is preferably cylindrical. The temperature of the male type, female type, and the environment of the tablet forming machine is not particularly limited, but is preferably less than or equal to 35 ° C. If the temperature exceeds 35 ° C, the viscosity increases through the reaction of the fixing resin composition, and thus, the fluidity can be deteriorated. The tablet formation pressure is preferably in the range equal to or greater than 400 × 104 Pa and equal to or less than 3000 × 104 Pa. When adjusting the tablet formation pressure to be equal to or less than the upper limit, the occurrence of fracture during transport can be inhibited. On the other hand, since a sufficient aggregating force is not obtained by adjusting the tablet forming pressure to be equal to or greater than the lower limit, the occurrence of fracture immediately after the tablet formation can be inhibited. The material of the male or female mold of the tablet forming machine and the surface treatment are not particularly limited, and known materials can be used. In addition, examples of surface treatment include electrical discharge processing, coating with a release agent, plating treatment, and polishing.
[0144] [00144] Furthermore, the glass transition temperature (Tg) of the fastener according to the present invention is preferably equal to or greater than 130 ° C, and more preferably equal to or greater than 140 ° C. If the glass transition temperature (Tg) is equal to or greater than the lower limit, increased reliability can be expected. The upper limit of the glass transition temperature (Tg) is not particularly limited, but is preferably less than or equal to 200 ° C, and more preferably less than or equal to 190 ° C. Thus, a rotor that has excellent durability is obtained.
[0145] [00145] Furthermore, in the present embodiment, the glass transition temperature (Tg) can be increased, for example, by raising the softening point of the epoxy resin or curing agent.
[0146] [00146] The flexural strength of the fastener according to the present invention at 150 ° C is preferably equal to or greater than 70 MPa, and more preferably equal to or greater than 100 MPa. If the flexural strength is equal to or greater than the lower limit, cracks are not easily generated and increased reliability can be expected. The upper limit of flexural strength is not particularly limited, but is preferably less than or equal to 300 MPa, and more preferably less than or equal to 250 MPa. Thus, a rotor that has excellent durability is obtained.
[0147] [00147] Incidentally, in the present embodiment, the flexural strength can be increased, for example, by treating the surface of the load with a coupling agent.
[0148] [00148] The upper limit of the elastic bending module of the fastener according to the present invention at 150 ° C is preferably equal to or less than 1.6 × 104 MPa, and more preferably equal to or less than 1.3 × 104 MPa. If the elastic bending modulus is equal to or less than the upper limit, increased reliability due to stress relaxation can be expected. The lower limit of the elastic bending modulus is not particularly limited, but is preferably equal to or greater than 5000 MPa, and more preferably equal to or greater than 7000 MPa. Thus, a rotor that has excellent durability is obtained.
[0149] [00149] Furthermore, in the present modality, the elastic bending modulus can be reduced, for example, by increasing the amount of addition of a low tension agent or by reducing the amount of mixture in the load.
[0150] [00150] In a region that is equal to or greater than 25 ° C and equal to or less than the glass transition temperature (Tg) of the fastener according to the present invention, the linear expansion coefficient (α1) is preferably equal or greater than 10 ppm / ° C and less than or equal to 25 ppm / ° C, and more preferably less than or equal to 15 ppm / ° C and less than or equal to 20 ppm / ° C. Within the above ranges, the difference in thermal expansion from that of an electromagnetic steel plate is small, and the loss of the magnet can be prevented. Thus, a rotor that has excellent durability is obtained.
[0151] [00151] Furthermore, in the present modality, the linear expansion coefficient (α1) can be reduced, for example, by increasing the amount of mixture of the load.
[0152] [00152] In the region that is equal to or greater than 25 ° C and equal to or less than the glass transition temperature (Tg) of the fixture according to the present invention, the linear expansion coefficient (α2) is preferably equal to or greater than 10 ppm / ° C and equal to or less than 100 ppm / ° C, and more preferably equal to or greater than 20 ppm / ° C and equal to or less than 80 ppm / ° C. Within the above ranges, the difference in thermal expansion from that of an electromagnetic steel plate is small, and the loss of the magnet can be prevented. Thus, a rotor that has excellent durability is obtained.
[0153] [00153] Furthermore, in the present modality, the linear expansion coefficient (α2) can be reduced, for example, by increasing the amount of mixture of the load. (Rotor manufacturing method)
[0154] [00154] The method of manufacturing the rotor 100 according to the present embodiment includes a step of preparing the rotor core 110, wherein a plurality of bore portions 150 arranged along the peripheral portion of a through hole through which a axis of rotation (axis 170) is penetrated is formed, a step of inserting a magnet 120 into the hole portion 150, a step of filling a fixing resin composition into a separation portion between the hole portion 150 and the magnet 120 , a step of curing the resin composition to obtain a fastener 130, and a step of inserting the shaft 170 into the through hole of the rotor core 110 while fixing and installing the shaft 170 in the rotor core.
[0155] [00155] In the present embodiment, in a technique used to fill a fixing resin composition, insertion molding is preferably used, which will be described in detail.
[0156] [00156] First, an insertion molding device will be described.
[0157] [00157] Figure 2 is a cross-sectional view of an upper mold 200 of an insertion molding device used in insertion molding.
[0158] [00158] As an example of a method of forming the fastener 130, a method which involves performing insertion molding using a tablet-like fixing resin composition can be used. For such insertion molding, an insertion molding device is used. Such a molding device includes an upper mold 200 having a container 210 in which a tablet-shaped fixing resin composition is provided and a flow passage 220 used to transfer the fixing resin composition in the molten state, a lower mold , a heating unit used to heat the upper mold and the lower mold, and an extrusion unit for extruding the fixing resin composition in the molten state. The insertion molding device can be provided, for example, with a transport function to transport a rotor core or the like.
[0159] [00159] In the present embodiment, the upper mold 200 and the lower mold are preferably closed on the upper surface and the lower surface of the rotor core 110 (i.e., a surface of the electromagnetic steel plate that constitutes the rotor core 110), and more preferably, they are, for example, in a plate format. The upper mold 200 and the lower mold of the present embodiment are different from the molds generally used to form a transfer mold that is used in a method of preparing a semiconductor device, as the upper mold 200 and the lower mold do not cover the entire core. rotor 110, that is, they do not cover, for example, a part on one side. The mold used for transfer molding is configured so that the entire semiconductor chip is arranged in a cavity made up of an upper mold and a lower mold.
[0160] [00160] Furthermore, the container 210 can have two other flow passages 220, and can have flow passages 220 in the form of Y. Thus, the fixing resin composition according to the present invention can be filled in two portions of hole of a container 210. In addition, a container may have a flow passage used to fill the fixing resin composition in one hole portion, but it can have three flow passages used to fill the fixing resin composition in three or more hole portions. Here, a plurality of flow passages can be independent of each other, but can be continuous.
[0161] [00161] Subsequently, insertion molding according to the present embodiment will be described.
[0162] [00162] First, a rotor core is preheated in an oven or a heat plate, and then fixed in a lower mold, not shown in the drawing, of a molding device. Subsequently, a magnet is inserted into the hole portions of the rotor core. Subsequently, the lower mold is raised and the upper mold 200 is pressed onto the upper surface of the rotor core. Thus, the upper surface and the lower surface of the rotor core 110 are inserted into the upper mold 200 and the lower mold. At that time, the distal end portion of the flow passage 220 in the upper mold 200 is arranged over the separation portion between the hole portion and the magnet. Furthermore, the rotor core is heated by thermal conduction from the lower mold and the upper mold 200 of the molding device. The temperature of the lower mold and upper mold 200 of the molding device is controlled, for example, at approximately 150 ° C to 200 ° C, which is suitable for molding and curing the rotor core fixing resin composition. In that state, the tablet-like fixing resin composition is provided in container 210 of the upper mold 200. The tablet-like fixing resin composition, provided in container 210 of the upper mold 200, is in the molten state when heating the in container 210.
[0163] [00163] Subsequently, the fixing resin composition in the molten state is extruded from the container 210 by a plunger (extrusion mechanism). In addition, the fixing resin composition moves through the flow passage 220, and is filled in the separation portion between the hole portion and the magnet. In this course, the rotor core is heated by thermally conducting the mold (the lower mold and the upper mold 200), thus curing the fixing resin composition filled therein, to form a fixing element. At that time, the temperature condition can be adjusted, for example, to 150 ° C to 200 ° C. In addition, the curing time can be adjusted, for example, from 30 seconds to 180 seconds. Thus, the magnet 120 inserted in the hole portion 150 is fixed by the fastening element 130. Then, the upper mold 200 is separated from the upper surface of the rotor core. Then, the axis 170 is inserted into the through hole of the rotor core 110 while the axis 170 is fixed and installed in the rotor core.
[0164] [00164] Through this, the rotor of the present mode is obtained.
[0165] [00165] Here, the insertion molding method of the present modality does not require demoulding, this is different from a transfer molding method used to manufacture a semiconductor device.
[0166] [00166] In the insertion molding method, while the upper surface of the rotor core 110 is kept closer to the upper mold 200, the resin passes through the flow passage of the upper mold 200 and is filled in the hole portion of the core. rotor 110. As a result, a large amount of resin is not filled between the upper surface of the rotor core 110 and the upper mold 200, fixing and separating between the upper mold 200 and the upper surface becomes easier.
[0167] [00167] On the other hand, in the transfer molding method, a resin is filled in a cavity between a semiconductor chip and a mold, and thus it is also necessary to perform the demoulding of the molded article. As a result, the release capacity between the mold and the molded article is required, particularly for a resin that encapsulates a semiconductor chip.
[0168] [00168] The rotor 100 of the present modality can be mounted on transport units, for example, motor vehicles such as hybrid cars, cars powered by fuel cells, and electric vehicles, trains, and boats and ships. EXAMPLES
[0169] [00169] In the following, the present invention will be described in detail with reference to Examples, however the present invention is in no way limited to the description in Examples. Unless otherwise specified, the "part (s)" and "%" as described below denote "part (s) by mass" and "% by mass", respectively.
[0170] [00170] The raw material components used in the respective Examples and Comparative Examples are shown below. (Thermosetting resin (A)) Epoxy resin 1: Biphenyl type epoxy (manufactured by Mitsubishi Chemical Corporation, YX4000K, ICI viscosity at 150 ° C: 0.11 poises) Epoxy resin 2: Tetramethyl bisphenol F type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., YSLV-80 XY, ICI viscosity at 150 ° C: 0.03 poises) Epoxy resin 3: Ortocresol novolac epoxy resin (manufactured by DIC Corporation, EPICLON N-665, ICI viscosity at 150 ° C: 3.06 poises) Epoxy resin 4: Phenolaralkyl type epoxy with a phenylene backbone (manufactured by Nippon Kayaku Co., Ltd., NC2000, ICI viscosity at 150 ° C: 1.20 poises) Epoxy resin 5: Phenolaralkyl type epoxy that has a biphenylene skeleton (manufactured by Nippon Kayaku Co., Ltd., NC3000, ICI viscosity at 150 ° C: 0.85 poises) Epoxy resin 6: Triphenylmethane epoxy resin (manufactured by Nippon Kayaku Co., Ltd., E-1032H-60, viscosity ICI at 150 ° C: 1.30 poises) Epoxy resin 7: Ortocresol novolac epoxy resin (manufactured by DIC Corporation, EPICLON N-670, viscosity ICI at 150 ° C: 4.28 poises)
[0171] [00171] In addition, the melting viscosity (viscosity ICI) at 150 ° C was measured with a Cone Plate Type Viscometer CV-1S (manufactured by TOA Industry Inc.) (Curing agent (B)) Curing agent based on phenolic resin 1: Novolac type phenolic resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-HF-3, viscosity ICI at 150 ° C: 1.08 poises) Curing agent based on phenolic resin 2: Phenolaralkyl resin that has a phenylene skeleton (manufactured by Meiwa Plastic Industries, Ltd., MEH-7800-4S, viscosity ICI at 150 ° C: 0.73 poises) Curing agent based on phenolic resin 3: Phenolaralkyl resin that has a biphenylene skeleton (manufactured by Meiwa Plastic Industries, Ltd., MEH-7851SS, ICI viscosity at 150 ° C: 0.68 points) Curing agent based on phenolic resin 4: Phenolic resin mainly formed from a reaction product of 2-hydroxybenzaldehyde, formaldehyde, and phenol (manufactured by Air Water Inc., HE910-20, viscosity ICI at 150 ° C: 1.5 Yeah) Curing agent based on phenolic resin 5: Novolac type phenolic resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-51714, viscosity ICI at 150 ° C: 1.64 poises) (Inorganic load (C)) Spherical silica 1 (manufactured by Denki Kagaku Kogyo Kabushiki Kaisha, FB-950, mean particle diameter D50 23 µm) Spherical silica 2 (manufactured by Denki Kagaku Kogyo Kabushiki Kaisha, FB-35, mean particle diameter D50 10 µm) Spherical silica 3 (manufactured by Admatechs Co., Ltd., SO25R, mean particle diameter D50 0.5 µm) Alumina (manufactured by Denki Kagaku Kogyo Kabushiki Kaisha, DAW-45, mean particle diameter D50 43 µm) (Curing accelerator (D)) Cure Accelerator 1: Triphenylphosphine Curing accelerator 2: Curing accelerator represented by the following formula (7)
[0172] [00172] Curing accelerator 3: Curing accelerator represented by the following formula (8)
[0173] [00173] Curing accelerator 4: Curing accelerator represented by the following formula (9)
[0174] [00174] Curing accelerator 5: Curing accelerator represented by the following formula (10)
[0175] [00175] In relation to the Examples and Comparative Examples, the mixture formed by mixing the respective components according to the amounts of mixture shown in Tables 1 and 2 was mixed at a normal temperature using a mixer to obtain an intermediate in powder form. The intermediate obtained in powder form was loaded into an automatic feeder (hopper), supplied quantitatively to a heating roller at 80 ° C to 100 ° C, and kneaded by melting. Then, the intermediate was cooled and then sprayed to obtain a fixing resin composition. The obtained fixing resin composition was molded into a tablet using a molding device to obtain a tablet.
[0176] [00176] On the other hand, a rotor was prepared in the following way, using an insert molding device provided with an upper mold 200 shown in Figure 2. First, the rotor core was fixed in the lower mold of a molding device, and subsequently, a neodymium magnet was inserted into the bore portion of a rotor core. Then, the lower mold was raised and the upper mold 200 was pressed onto the upper surface of the rotor core. Subsequently, the tablet resin fixing resin composition was supplied to container 210 of the upper mold 200, and then the molten fixing resin composition was extruded from container 210 by a plunger. The fixing resin composition was filled in a separation portion between the hole portion and a neodymium magnet. Then, the filled resin composition was heated and cured to form a fixture, thereby obtaining a rotor. Here, the molding conditions are as follows: a rotor core temperature: 160 ° C and a curing time: 120 seconds.
[0177] [00177] For the obtained fixation resin composition and the rotor, the measurements and evaluations as shown below were performed. The results are shown in Tables 1 and 2. The rotors in the Examples are excellent in strength. (Evaluation items)
[0178] [00178] Spiral flow: The fixing resin composition was injected into a mold used for measuring spiral flow according to ANSI / ASTM D 3123-72, using a low pressure transfer molding machine (KTS-15, manufactured by Kohtaki Precision Machine Co., Ltd.) for insertion molding under 175 ° C conditions, an injection pressure of 6.9 MPa, and a retention time of 120 seconds, and the flow length was measured. Spiral flow is a fluidity parameter, and a higher flow rate indicates better fluidity. The unit of the spiral flow in Tables 1 and 2 is cm.
[0179] [00179] Gel time: The fixing resin composition was loaded onto a controlled thermal plate at 175 ° C, and then kneaded with a spatula in a stroke of approximately once / sec. After the fixing resin composition is heat-melted, the time spent for curing is measured and defined as a gel time. The gel time unit in Tables 1 and 2 is sec.
[0180] [00180] Koka-type viscosity: About 2.5 g of the fixing resin composition was formed into a tablet (diameter of 11 mm, height of about 15 mm), and then the Koka-type viscosity was measured using a Koka Viscosity measurement (CFT-500D manufactured by Shimadzu Corporation), with nozzles (cubes) with a diameter of 0.5 mm and a length of 1.0 mm, under the conditions of a measurement temperature of 175 ° C and a load of 10 kg. The Koka Viscosity unit in Tables 1 and 2 is Pa · s.
[0181] [00181] Torque Viscoelasticity Ratio: When the curing torque of the fixing resin composition is measured over time at a measurement temperature of 175 ° C using a viscoelasticity meter (JSR type IVPS viscoelasticity meter, manufactured by Orientec Co., Ltd.), the curing torque value at 60 seconds after starting the measurement was set to T60 and the maximum curing torque value up to 300 seconds after starting the measurement is set to Tmax, the ratio of the value of cure torque in 60 seconds after the start of the measurement to the maximum cure torque value up to 300 seconds after the start of the measurement, T60 / Tmax (%), was determined as a viscoelasticity torque ratio. The torque in the viscoelasticity meter is a parameter of thermal stiffness, and thus a higher viscoelasticity torque ratio indicates better curability.
[0182] [00182] Slit Flow Length: The fixing resin composition was injection molded into a mold radially supplied with grooves (slits) that have a specific thickness with the tips open under the conditions of a mold temperature of 175 ° C , a molding pressure of 6.9 MPa, an injection time of 20 seconds, and a curing time of 90 seconds, and the length of the resin flowing out of the crack with a width of 3 mm and a thickness of 80 µm was measured with a caliper. The unit is mm.
[0183] [00183] Rotor Molding Capacity: A mold (a width of 30 mm, a thickness of 4 mm, and a depth of 75 mm of the hole portions) selected as an electromagnetic steel plate, in which a piece of metal ( a width of 28 mm, a thickness of 3.8 mm, and a length of 74 mm) selected as a magnet was inserted, adjusted on a molding machine. Then, when the mold temperature reaches 170 ° C, the fixing resin composition is injection molded, and the mold is removed from the molding machine after a curing time of 120 seconds. The appearance of the molded article is visually observed to check for any abnormalities such as an empty space. The state where there is no abnormality as an empty space is denoted as A and the state where there is abnormality as an empty space is denoted as B.
[0184] [00184] Glass transition temperature: The fixing resin composition was injection molded using a low pressure transfer molding machine (KTS-30, manufactured by Kohtaki Precision Machine Co., Ltd.) for insertion molding under the conditions of a mold temperature of 175 ° C, an injection pressure of 9.8 MPa, and a curing time of 2 minutes to obtain a test piece in 4 mm × 4 mm × 15 mm. After curing the test piece obtained at 175 ° C for 4 hours, the linear expansion coefficient (α1) in the region equal to or less than the glass transition temperature and the linear expansion coefficient (α2) in the region corresponding to the state of rubber are determined, from the graph, as measured at a temperature rise rate of 5 ° C / min in the temperature region over a measurement temperature range of 0 ° C to 320 ° C, using a temperature analysis device thermal machine (TMA100, manufactured by Seiko Eletronics Industrial Co., Ltd). Here, the intersection of the extended lines of α1 and α2 is defined as a glass transition temperature. In Tables 1 and 2, the glass transition temperature unit is ° C and the unit of linear expansion coefficients (α1, α2) is ppm / ° C
[0185] [00185] Flame resistance: The fixing resin composition was injection molded under the conditions of a mold temperature of 175 ° C, an injection pressure of 9.8 MPa, an injection time of 15 seconds, and a curing time of 120 seconds using a low pressure transfer molding machine (KTS-30, manufactured by Kohtaki Precision Machine Co., Ltd.) for insertion molding, to prepare a flame resistant test piece that has 127 mm × 12.7 mm × thickness of 3.2 mm. The test piece was subjected to a flame resistance test according to a standard specified in the UL-94 vertical method to determine the flame resistance. Flame and similar ratings are shown. Since the flame retardancy is not an essential condition in the present invention, the flame retardancy can be appropriately adjusted.
[0186] [00186] Breaking energy a and b: A curable product of a rotor fastening resin composition, molded into a dumbbell shape according to JIS K7162 (hereinafter referred to as a test piece), has been subjected to a tensile test under the conditions of a loading speed of 1.0 mm / min at 25 ° C or 150 ° C. In this tensile test, Tensilon UCT-30T Type manufactured by Orientec Co., Ltd. was used as a Tensilon and Type KFG-2-120-D16-11L1M2R manufactured by Kyowa Electronic Instruments Co., Ltd. was used as an extensometer.
[0187] [00187] The relationship between vertical stress and vertical strain was plotted on a curve (stress-strain curve). Then, using the strain as the variables, the integral values of the strain from the beginning until the rupture in the tensile test were calculated. In addition, the unit is × 10-4 J / mm3.
[0188] [00188] Oil resistance: the fixing resin composition was injection molded under the conditions of a mold temperature of 175 ° C, an injection pressure of 9.8 MPa, and a curing time of 120 seconds, using a molding machine (KTS-30, manufactured by Kohtaki Precision Machine Co., Ltd.), to obtain a molded article (curable product) that has a length of 80 mm, a width of 10 mm, and a thickness of 4 mm . The molded article obtained which was heat treated at 175 ° C for 4 hours as a post-cure was used as a test piece, and the flexural strength and elastic flexural modulus were measured under an atmosphere at 25 ° C. ° C according to JIS K 6911. This test piece was then placed in a pressure-resistant container and the pressure-resistant container was immersed at a temperature of 150 ° C and 1000 hours in the state where ATF oil (Nissan Matic fluid D) it was filled in the container, and then the flexural strength and elastic modulus of flexion were measured by this method as described above. A case where the rate of change from initial values before immersion in ATF oil is equal to or less than 10% is defined as A and a case where the rate of change from initial values before immersion in ATF oil is greater that 10% is defined as B.
[0189] [00189] ATF Immersion Test (1000 hours): the fixing resin composition was injection molded under the conditions of a mold temperature of 175 ° C, an injection pressure of 9.8 MPa, and a time of curing for 120 seconds using a molding machine (KTS-30, manufactured by Kohtaki Precision Machine Co., Ltd.), to obtain a molded article (curable product) that has a length of 80 mm, a width of 10 mm, and a thickness of 4 mm. The molded article obtained which was subjected to a heat treatment at 175 ° C for 4 hours as a post-cure was used as a test piece, and the weight X1 and volume Y1 before immersion in ATF were measured. The test piece was then placed in a pressure-resistant container and immersed at 150 ° C for 1000 hours in the state where ATF was filled. In addition, the test piece was removed from the pressure-resistant container and the ATF adhered to the surface was washed. Then, weight X2 and volume Y2 after immersion in ATF were measured, and the rate of change in weight and the rate of change in volume between before and after immersion in ATF were calculated by the following equations. Rate of change [%] of weight between before and after immersion in ATF = (X2-X1) / X1 × 100 Rate of change [%] of volume between before and after immersion in ATF = (Y2-Y1) / Y1 × 100
[0190] [00190] In addition, such as ATF, Fluid Matic D (manufactured by Nissan Motor Co., Ltd.), Automatic Fluid Type T-IV (manufactured by Toyota Motor Corporation), and ATF DW-1 (manufactured by Honda R&D Co. , Ltd.) were used, respectively.
[0191] [00191] ATF Immersion Test (2000 hours): In the same way for the ATF immersion test (1000 hours) except that the ATF immersion time has been changed to 2000 hours, the rate of weight change and the rate volume changes between before and after immersion in ATF were calculated, respectively. Elimination of inorganic filler: After the ATF immersion test, the ATF oil was removed by filtration and the presence or absence of the inorganic filler in the filter paper was verified by microscopy.
[0192] [00192] From Examples 1 to 6, it could be seen that a fixing resin composition, which has excellent filling properties, mechanical properties, and oil resistance and can exhibit satisfactory properties in an ATF immersion test, can be obtained.
[0193] [00193] Furthermore, in Comparative Examples 1 and 2, where the ICI viscosity of the epoxy resin exceeds 3, the slit flow length of 80-m is less than 75 in any case. Thus, in Comparative Examples 1 and 2, a fixing resin composition that has sufficient filling properties could not be obtained.
[0194] [00194] Furthermore, it is evident that the modalities and a plurality of such modifications as described above can be combined within a range of quantities that do not conflict with each other. In addition, the structures of the respective portions in the modalities and a plurality of such modifications as described above are specifically described above, and various modifications can be added within a range that satisfies the present invention. LIST OF NUMERICAL REFERENCES 100 Rotor 110 Rotor Core 112 Steel Plate 114 End Plate 116 Grooves 118a, 118b End Plate 120 Magnet 121 Sidewall 123 Sidewall 130 Fastening Element 140 Fill Portion 150 Hole Portion 151 Sidewall 152 Hole Portion 153 Sidewall 154a, 154b Hole Portion 156 Hole Portion 160 Caulking Portion 170 Axle 200 Top Mold 210 Container 220 Flow Passage

权利要求:
Claims (12)
[0001]
Solid fastening resin composition to form a fastening element (130) that constitutes a rotor (100), characterized by the fact that it includes: a rotor core (110) which has a laminate formed by laminating a plurality of plate elements (112) and is fixed and installed on a rotating axis (170), in which a plurality of hole portions (150, 152 , 154a, 154b, 156) arranged along the peripheral portion of the axis (170) of rotation is provided in the laminate; a magnet (120) inserted in the hole portions (150, 152, 154a, 154b, 156); and a fixing element (130) formed when curing the fixing resin composition filled in a separation portion between the hole portion (150, 152, 154a, 154b, 156) and the magnet (120), the fixing resin composition comprises: a thermoset resin (A) containing an epoxy resin; a curing agent (B); and an inorganic charge (C) that includes silica or alumina, where the ICI viscosity at 150 ° C of the epoxy resin as measured with a CV-IS Plate Cone Viscometer manufactured by TOA Industry Inc. is equal to or less than 3 poises. the amount of the inorganic filler (C) is equal to or greater than 50% by mass, based on 100% by mass of the total amount of the fixing resin composition, and the ICI viscosity at 150 ° C of the curing agent (B) as measured with a CV-IS Plate Cone Viscometer manufactured by TOA Industry Inc. is equal to or less than 2 poises.
[0002]
Fixing resin composition according to claim 1, characterized in that when the fixing resin composition is injected into a flow passage (220) which has a cross-sectional shape with a width of 3 mm and a 80 µm thickness under the conditions of a mold temperature of 175 ° C, a molding pressure of 6.9 MPa, and an injection time of 20 seconds, the slit flow length is equal to or greater than 75 mm.
[0003]
Fixing resin composition according to any one of claims 1 to 2, characterized by the fact that the epoxy resin includes at least one selected from the group consisting of a biphenyl epoxy resin, a phenolaralkyl epoxy resin that has a phenylene skeleton, a phenolaralkyl-type epoxy resin that has a biphenylene skeleton, a novolac phenol-type epoxy resin, a novolac orthocresol-type epoxy resin, a bisphenol-type epoxy resin, a bisnaftol-type epoxy resin, a dicyclopentadiene-type epoxy resin, epoxy resin type dihydro anthracenediol, and an epoxy resin type triphenylmethane.
[0004]
Fixing resin composition according to any one of claims 1 to 3, characterized by the fact that the curing agent (B) includes at least one selected from the group consisting of a novolac-type phenolic resin, a phenolaralkyl that has a phenylene backbone, a phenolaralkyl resin that has a biphenylene backbone, a naphthol type phenolic resin, and a phenolic resin mainly formed from a reaction product of hydroxybenzaldehyde, formaldehyde, and phenol.
[0005]
Fixing resin composition according to any one of claims 1 to 4, characterized in that the epoxy resin is a crystalline epoxy resin.
[0006]
Fixing resin composition according to any one of claims 1 to 5, characterized by the fact that the Koka viscosity of the fixing resin composition, as measured at a measuring temperature of 175 ° C and a load of 10 kg using a Koka Viscosity measuring device, it is equal to or greater than 3 Pa · s if equal to or less than 50 Pa · s.
[0007]
Fixing resin composition according to any one of claims 1 to 6, characterized in that the gel time of the fixing resin composition at 175 ° C is equal to or greater than 10 seconds and equal to or less than 50 seconds , where the gel time is measured as follows: the fixing resin composition is loaded onto a heat plate controlled at 175 ° C and then kneaded with a spatula in a course of approximately once / second, and after fixing resin composition is melted by heat, the time taken to cure is measured and defined as a gel time.
[0008]
Fixing resin composition according to any one of claims 1 to 7, characterized in that the spiral flow of the fixing resin composition is equal to or greater than 50 cm, in which the spiral flow is measured as follows: the fixing resin composition is injected into a mold used for the measurement of spiral flow according to ANSI / ASTM D 3123-72, using a low pressure transfer molding machine (KTS-15, manufactured by Kohtaki Precision Machine Co ., Ltd.) for insertion molding under 175 ° C conditions, an injection pressure of 6.9 MPa, and a retention time of 120 seconds, and the flow length is measured.
[0009]
Fixing resin composition according to any one of claims 1 to 8, characterized in that when the curing torque of the fixing resin composition is measured over a period of time at a measurement temperature of 175 ° C using a curelastometer, the cure torque value at 60 seconds after the measurement starts is set to T60 and the maximum cure torque value up to 300 seconds after the measurement starts is set to Tmax, the ratio of the cure torque value in 60 seconds after the start of the measurement until the maximum cure torque value up to 300 seconds after the start of the measurement, T60 / Tmax (%), is equal to or greater than 40%.
[0010]
Rotor characterized by the fact that it comprises: a rotor core (110) which has a laminate formed by laminating a plurality of plate elements and is fixed and installed on an axis (170) of rotation, in which a plurality of hole portions arranged along the peripheral portion of the axis (170) of rotation is provided on the laminate; a magnet (120) inserted in the hole portions; and a fixing element (130) formed when curing the fixing resin composition filled in a separation portion between the hole portion (150, 152, 154a, 154b, 156) and the magnet (120), wherein the fixing resin composition used to form the fixing element (130) that forms the core is the fixing resin composition, as defined in any one of claims 1 to 9.
[0011]
Automobile characterized by the fact that it comprises the rotor (100), as defined in claim 10.
[0012]
Method of manufacturing a rotor, which is carried out using the fixing composition, as defined in any of claims 1 to 9, characterized by the fact that it comprises: a step of preparing a rotor core (110) having a laminate formed by laminating a plurality of plate elements and having a plurality of hole portions arranged along the peripheral portion of a through hole through which an axis (170 ) of rotation is penetrated, supplied on the laminate; a step of inserting a magnet (120) into the hole portion (150, 152, 154a, 154b, 156); a step of filling the fixing resin composition into a separation portion between the hole portion (150, 152, 154a, 154b, 156) and the magnet (120); and a step of inserting the rotating shaft (170) into the bore through the rotor core (110), and fixing and installing the rotating shaft (170) in the rotor core (110).

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同族专利:

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公开号 | 公开日

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EP2787606B1|2021-02-17|

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SI2787606T1|2021-07-30|

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WO2013080654A1|2013-06-06|

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US20140327329A1|2014-11-06|

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JP6089900B2|2017-03-08|

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PL2787606T3|2021-07-19|

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KR101870489B1|2018-07-19|

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HUE054387T2|2021-09-28|

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JP2013136794A|2013-07-11|

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JP2013136725A|2013-07-11|

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BR112014012761A8|2017-06-20|

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US9997968B2|2018-06-12|

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SG11201402724TA|2014-09-26|

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CN110752687A|2020-02-04|

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JP5257541B2|2013-08-07|

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CN103975506A|2014-08-06|

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BR112014012761A2|2017-06-13|

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KR20140103920A|2014-08-27|

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EP2787606A1|2014-10-08|

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EP2787606A4|2015-07-08|

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法律状态:
2018-12-11| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|

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2019-10-08| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|

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2020-10-27| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|

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2021-01-12| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 02/10/2012, OBSERVADAS AS CONDICOES LEGAIS. |

优先权:

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申请号 | 申请日 | 专利标题

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JP2011260440|2011-11-29|

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JP2011-260440|2011-11-29|

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PCT/JP2012/075560|WO2013080654A1|2011-11-29|2012-10-02|Resin composition for fixing, rotor, automobile, and method for manufacturing rotor|

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